Monolithically integrated semiconductor element
use thereof and method for producing such a semiconductor element
Invention DE4332653
- Monolithisch integriertes Halbleiterelement, dessen Verwendung sowie Verfahren zur Herstellung eines solchen Halbleiterelements
- Germany DE4332653, September 1994
Inventors
Erfinder | ALAVI, Mani – Dipl.-Ing. Dr.rer.nat. [DE];
FABULA, Thomas – Dipl.-Phys. [DE]; SCHUMACHER, Axel – Dipl.-Phys. [DE]; WAGNER, Hans-Joachim – Dipl.-Phys. [DE] |
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Abstract
The monolithically integrated semiconductor element has a bar structure arranged over a diaphragm and located on support webs. The diaphragm, support webs and bar structure are integrally formed from a common semiconductor substrate and have edge faces which are defined by differential etching rates in different crystal orientations of the semiconductor substrate. Such a semiconductor element is produced by applying a mask layer onto opposite surfaces of a semiconductor substrate having a predetermined crystal orientation, subsequent uniform planar destruction or partial destruction of the crystal structure followed by anisotropic etching until the bar structure has been uncovered by etching and a diaphragm with a predetermined thickness remains under the bar. A monocrystalline silicon substrate with a <110> surface crystal orientation has proved particularly suitable. The monolithically integrated semiconductor element according to the invention is, in particular, suitable for use as a sensor or electromechanical transducer.
Patent
Technical Paper
- Microsystem Technologies, Volume 1, Issue 4, pp 191-195
- Monolithic bridge-on-diaphragm structure for pressure sensor applications
GitHub repository
PDF-Download Patent
- BOD-Paper
- BOD-German Patent DE4332653C1
- BOD-Drawings DE4332653C1_drawings