Monolithically integrated semiconductor element

use thereof and method for producing such a semiconductor element

 

Invention DE4332653

Inventors

Erfinder ALAVI, Mani – Dipl.-Ing. Dr.rer.nat. [DE];

FABULA, Thomas – Dipl.-Phys. [DE];

SCHUMACHER, Axel – Dipl.-Phys. [DE];

WAGNER, Hans-Joachim – Dipl.-Phys. [DE]

 

 

Abstract

The monolithically integrated semiconductor element has a bar structure arranged over a diaphragm and located on support webs. The diaphragm, support webs and bar structure are integrally formed from a common semiconductor substrate and have edge faces which are defined by differential etching rates in different crystal orientations of the semiconductor substrate. Such a semiconductor element is produced by applying a mask layer onto opposite surfaces of a semiconductor substrate having a predetermined crystal orientation, subsequent uniform planar destruction or partial destruction of the crystal structure followed by anisotropic etching until the bar structure has been uncovered by etching and a diaphragm with a predetermined thickness remains under the bar. A monocrystalline silicon substrate with a <110> surface crystal orientation has proved particularly suitable. The monolithically integrated semiconductor element according to the invention is, in particular, suitable for use as a sensor or electromechanical transducer.

 

Patent

Technical Paper

  • Microsystem Technologies, Volume 1, Issue 4, pp 191-195
  • Monolithic bridge-on-diaphragm structure for pressure sensor applications

BOD01

BOD02

BOD03

BOD04

GitHub repository

 

PDF-Download Patent

 

Hahn-Schickard-Gesellschaft für Angewandte Forschung e.V.

hsg_imit_144x100

Monolithic BOD-structure